APR-5000 Array Package Rework System (BGA Rework System) is a powerful and compact system that provides closed loop control, optimized vision and precise component placement.
Capable of handling boards with a placement accuracy of 0.025 mm and interconnection pitches of 0.3mm, the APR-5000 is ideal for reworking smaller assemblies such as cell phones and laptop computers.
The system incorporates OK INTERNATIONAL’s BGA rework technology to deliver best-in-class BGA/CSP functionality with professional performance at an affordable price.
Features
Easy-to-program software manages the five stages of the reflow profile: preheat, soak, ramp, reflow and cooling.
Board temperature can be monitored using flying thermocouples.
Single reflow/placement head moves to correct position keeping pcb stationery ensuring uniformity and higher process yields by achieving a consistent and tight delta T across the board and component.
The pcb is centralised relative to the pre-heaters to provide superior uniformity of pcb temperature during rework.
Real time adjustments can be made to all the parameters while the profile is running.
The APR-5000 provides full convection in both reflow heaters and pre-heaters to provide fast ramp and precise peak temperature without thermal damage to sensitive components.
