DEK
CYBER OPTICS
VITRONICS SOLTEC
PVA
CENCORP

NUTEK

DATAPAQ
MICRO-TEC
OK INTERNATIONAL
JAPAN UNIX
STENCILS & SCREENS
MICRO-TEC
Z-Check 500
Z-Check 500 is the low cost entry level, non-contact thickness measuring instrument for the fast and accurate measurement of Solder Paste, Adhesives (Glue), Components and Leads. The high precision measuring mechanism, with a measuring range of 10mm, is securing mounted on a robust, large granite base, making Z-Check 500 ideally suitable in any production or laboratory environment.

Z-Check 500 works by differentially focusing between the sample substrate and the top of the sample being measured, ie solder pad. Operator error is removed by a unique optical sighting system. A micro-slit of white light is projected onto the sample surface from an acute angle. When this is coincident with a central graticule on the monitor, the subject is in focus. When the sample is moved, the light slit also moves laterally and bringing this back to coincide with the graticule, refocuses the instrument.

The distance moved by the microscope in refocusing, is the difference in height between the first and second position, and is displayed on the instrument. In this way varying interpretations by different operators on the focus position is eliminated. Typical accuracy is 3 micron. Both the micro slit of light and surface illumination can be individually adjusted to suit any surface condition.

MAJOR FEATURES
  • 3 micron typical accuracy in Z axis measurement
  • White light source
  • Granite base
  • Monochrome monitor
  • Competitively priced
 
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