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Reflow Soldering Equipments

XPM2+ Series XPM3 Series

XPM Reflow Ovens XPM2+ Series
The Vitronics Soltec XPM2+ product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transfer system consistently deliver benchmark thermal performance, precise process control, and superior value for high production, 24 hours-a-day, 7days-a-week environments.

The XPM2+ is designed to handle new and stringent process requirements like Lead Free soldering for SMT and Semiconductor Packaging. There is no compromise with Vitronics Soltec XPM2+. Just what you'd expect from Vitronics Soltec, the World Leader in Soldering Technology.

Features:

  • Minimal Delta T
  • High Throughput
  • Short Footprint
  • Low Energy Use
  • Low Surface Temperature
  • Single Exhaust Point
  • Reduced Energy Consumption
  • Full Accessibility
  • Increased Heat Transfer
  • Integrated Gas Management
  • Meets The Lead Free Challenge


XPM3 Series
The Vitronics Soltec XPM3 product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transfer system consistently deliver benchmark thermal performance, precise process control, and superior value for high production, 24 hours-a-day, 7days-a-week environments.

The XPM3 is designed to handle new and stringent process requirements like Lead Free soldering for SMT and Semiconductor Packaging. There is no compromise with Vitronics Soltec XPM3. Just what you'd expect from Vitronics Soltec, the World Leader in Soldering Technology.

Multi-configurability gives you the flexibility to develop a wide range of optimized processing profiles while maintaining desired conveyor speed. XPM3. maintains strong heating zone definition for stable, robust profile development, process control, and guaranteed repeatability.

  • Minimal Delta T
  • High Throughput
  • Short Footprint
  • Powerful Cooling
  • Less Nitrogen Usage
  • Low Maintenance
  • Energy Efficient
  • Full Accessibility
  • More Efficient Processing
  • Integrated Gas Management
  • Meets The Lead Free Challenge
 
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