VP1000

 

PRODUCT DESCRIPTION

The modern design of the machines and the physical laws of the process permit to defect-free soldering of the most complicated SMT assemblies even with lead-free solder pastes.

The machines are particular suited for users who process product with frequently changing assemblies in small and medium sized quantities. Universal workpiece carries make the system very flexible.

ADVANTAGES

  • Economical soldering system for highest technological requirements

  • Oxidation-free pre-heat and soldering process

  • Homogeneous temperature distribution on the whole assembly

  • Overheating of the solder product is impossible

  • No shadowing or color selectivity

  • Reproducible process conditions

  • No time-consuming for generation of temperature profiles

  • Low operating costs

  • Universally useable for series and individual operation

 

VP2000

PRODUCT DESCRIPTION

The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are processed with high quality results.

The system is designed for inline operation in mass-production lines for bare board processing of assemblies. Electrically adjustable conveyors and center supports permit quick and easy integration into the flexible production environment.

ADVANTAGES

  • High rate of throughput with in-line processing

  • Oxidations-free pre-heating and soldering process

  • Homogeneous temperature distribution over the whole assembly

  • Overheating the solder product is impossible

  • No shadowing or color selectivity

  • Reproducible process conditions

  • No time-absorbing generation of temperature profiles

  • Low production costs

  • Control and failure message system.

VP2000

PRODUCT DESCRIPTION

The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are processed with high quality results.

The system is designed for inline operation in mass-production lines for bare board processing of assemblies. Electrically adjustable conveyors and center supports permit quick and easy integration into the flexible production environment.

ADVANTAGES

  • High rate of throughput with in-line processing

  • Oxidations-free pre-heating and soldering process

  • Homogeneous temperature distribution over the whole assembly

  • Overheating the solder product is impossible

  • No shadowing or color selectivity

  • Reproducible process conditions

  • No time-absorbing generation of temperature profiles

  • Low production costs

  • Control and failure message system.