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The QX150i AOI system offers high value and high flexibility for all applications and is ideally suited for pre-reflow and selective solder inspection. The Strobed Inspection Module (SIM), the core engine behind QX150i™, enables on-the-fly inspection assuring a fast and smooth process.


  • Ideal for Pre-Reflow and Selective Solder Applications

  • 01005 Inspection Capability

  • Easy Wedge-in Replacement of Existing Conveyor

  • Fastest Programming with AI² in <13 minutes

  • 3-Year Standard Warranty* Advantage


Board Width                                                          50 x 308 mm

Board Length                                                        50 x 457mm

Resolution                                                             12µm pixel size

Inspection Speed                                                  150cm²/sec



The QX150 is powered by an all-new SIM (Strobed Inspection Module) with enhanced illumination – designed to deliver true, in-line inspection performance. The SIM enables on-the-fly inspection making the QX150™ the fastest tabletop ever at 150 cm²/sec. A higher sensor resolution (12µm) offers superior quality images for more accurate defect review. And, as always, the SIM is calibration-free.


  • World’s fastest tabletop at 150 cm²/sec

  • True, in-line inspection capability with all-new SIM (Strobed Inspection Module)

  • Higher resolution (12µm) for superior quality images

  • Quick setup and fast programming with AI² technology

  • Lowest false call rate and zero escapes

  • 100% program compatibility with CyberOptics’ in-line systems


Specifications                                                 QX150™                                                                        QX150-M™

Board Width                                                50 x 320 mm                                                                  50 x 320 mm

Board Length                                              50 x 330 mm                                                                  50 x 510 mm

Resolution                                                   12µm pixel size

Inspection Speed                                       Up to 150 cm²/sec



The QX600 is designed with an all-new SIM (Strobed Inspection Module) with enhanced illumination – delivering the best 01005 and solder joint inspection performance ever.

With a higher sensor resolution (12 µm), you get to see crisp, perfect quality images for more accurate defect review.


  • All-new SIM (Strobed Inspection Module) with Enhanced Illumination

  • Higher Resolution (12 µm) for perfect, crisp quality images

  • Production Ready in <13 minutes* with AI²

  • 01005 Inspection Capability

  • Improved Solder Joint and Gold Finger Inspection

Lowest False Call Rate and Zero Escapes
*for pre-defined parts


Specifications                             QX600™                                 QX600-L™

Board Width                               50 x 308 mm                         50 x 590 mm

Board Length                             50 x 457 mm                         50 x 510 mm

Resolution                                 12µm pixel size

Inspection Speed                       200cm²/sec



SQ3000 3D Automated Optical Inspection (AOI) system maximizes ROI and line utilization with 3D multi-view sensors that enable fastest 3D inspection in the industry. SQ3000 incorporates Multi-Reflection Suppression technology (MRS) and highly sophisticated 3D algorithms offering microscopic image quality at production speeds. SQ3000-X offers expanded capabilities supporting large boards up to 710 x 620 mm, inspecting the most demanding assemblies   without compromising measurement accuracy and repeatability.

MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is unmatched speed and accuracy.


  • Fastest 3D inspection in the industry with architecturally faster 3D sensor

  • Microscopic image quality at production speed enabled by Multi-Reflection Suppression (MRS) technology

  • Inhibits reflection issues with MRS technology

  • Generates high precision images of entire PCB in full color with 3D image fusing algorithms

  • Simpler and faster inspection with AI² technology using 2D/3D images

  • Delivers precision accuracy, GR&R and lowest false call rates

  • Accurate pin height/package coplanarity measurement

  • Easy-to-use with simple intuitive interface and touch control


Specifications                                                      MRS Sensor


Board Size                                                              510 x 510 mm

Resolution                                                              Sub 10µm

Inspection Speed                                                  40 cm²/sec (2D+3D)

Component Height Clearance                            50mm

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