OvenCHECKER

PRODUCT DESCRIPTION

Reflow Process Verification... Made Easy!

ECD, the world leader in thermal profiling solutions, introduces a new, easy to use yet powerful tool for verifying a production reflow oven - OvenCHECKER™

Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification.

 

OvenCHECKER™ greatly simplifies the verifying process because it's a "Plug ‘N Play" system that will have your production Operator “checking” oven performance almost immediately. OvenCHECKER™ utilizes the V-M.O.L.E.® Thermal Profiler's innovative "OK Button" feature, indicating Go/No-Go (relative to your profile specifications) at the touch of a button. This helps minimize costly production line down-time since data does not need to be transferred to a PC for further analyzes (when the LED indicator is Green).

ADVANTAGES

  • Plug ‘n Play system to have Engineers-to-Operators “Checking” oven performance immediately

  • Long-life pallet designed for 1,000+ reflow runs that includes 3 sensors and a Thermal Barrier

  • V-M.O.L.E.® thermal profiler that includes the exclusive ECD “OK Button” to indicate Go/No-Go relative to profile specifications

  • M.O.L.E.® MAP software for in-depth analysis

  • With the purchase of additional thermocouples, you can remove the profiler from the pallet and attach directly to your own PCB.

  • ECD-exclusive “OK Button” makes for quick work of assessing profile to be IN or OUT of specification.

SPECIFICATIONS

Physical Dimensions:                                                                                       Length: 15.0in. (38.1cm)
                                                                                                                             Height: 1.0in. (2.54cm) 
                                                                                                                             • [17.8mm (0.7") above conveyor chain] 
                                                                                                                             • [7.6mm (0.3") below conveyor chain] 
                                                                                                                             Width: 12in. (30.5cm)

Weight (OvenCHECKER™ only):                                                                       12in. – 3.65 lbs. (1656 grams)

Max Operational Temperature:                                                                       392.0°F (200°C) for 10 minutes

Sampling Interval (V-M.O.L.E.®):                                                                      1.0 second

Data Capacity (V-M.O.L.E.®):                                                                             0.056°C (0.1° F)

Physical Dimensions:                                                                                         90+ Runs before download

Power Supply (V-M.O.L.E.®):                                                                             USB Rechargeable Lithium Polymer

 

PRODUCT DESCRIPTION

The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are processed with high quality results.

The system is designed for inline operation in mass-production lines for bare board processing of assemblies. Electrically adjustable conveyors and center supports permit quick and easy integration into the flexible production environment.

ADVANTAGES

  • High rate of throughput with in-line processing

  • Oxidations-free pre-heating and soldering process

  • Homogeneous temperature distribution over the whole assembly

  • Overheating the solder product is impossible

  • No shadowing or color selectivity

  • Reproducible process conditions

  • No time-absorbing generation of temperature profiles

  • Low production costs

  • Control and failure message system.

 

PRODUCT DESCRIPTION

The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are processed with high quality results.

The system is designed for inline operation in mass-production lines for bare board processing of assemblies. Electrically adjustable conveyors and center supports permit quick and easy integration into the flexible production environment.

ADVANTAGES

  • High rate of throughput with in-line processing

  • Oxidations-free pre-heating and soldering process

  • Homogeneous temperature distribution over the whole assembly

  • Overheating the solder product is impossible

  • No shadowing or color selectivity

  • Reproducible process conditions

  • No time-absorbing generation of temperature profiles

  • Low production costs

  • Control and failure message system.